Display device and method of manufacturing the same

ABSTRACT

A display device and a method of manufacturing the same are disclosed, in which arcing may be prevented from occurring. The display device comprises a first substrate including a display area on which pixels are arranged, and a non-display area surrounding the display area; a dam surrounding the display area, arranged on the non-display area; a pad electrode arranged outside the dam; and an encapsulation film covering the display area and including a first inorganic film and a second inorganic film arranged on the first inorganic film, wherein the second inorganic film is overlapped with the pad electrode.

CROSS REFERENCE TO RELATED APPLICATION

This application claims the benefit of the Korean Patent Application No.10-2017-0143997 filed on Oct. 31, 2017, which is hereby incorporated byreference in its entirety for all purposes as if fully set forth herein.

BACKGROUND Field of the Disclosure

The present disclosure relates to a display device and a method ofmanufacturing the same.

Description of the Background

With the advancement of the information age, a demand for a displaydevice for displaying an image has been increased in various forms.Therefore, various display devices such as liquid crystal display (LCD)devices, plasma display panel (PDP) devices, and organic light emittingdisplay (OLED) devices have been used.

Among the display devices, the organic light emitting display device isa self-light emitting device, and has advantages in that a viewing angleand a contrast ratio are more excellent than those of the liquid crystaldisplay (LCD) device. Also, since the organic light emitting displaydevice does not require a separate backlight, it is advantageous thatthe organic light emitting display device is able to be thin andlightweight and has low power consumption. Furthermore, the organiclight emitting display device has advantages in that it may be driven ata low direct current voltage, has a fast response speed, and especiallyhas a low manufacturing cost.

However, the organic light emitting display device includes pixels, eachof which includes an organic light emitting diode, and has adisadvantage in that the organic light emitting diode may be easilydegraded by external factors such as external water and oxygen. In orderto prevent this, the organic light emitting display device forms anencapsulation film to prevent external water and oxygen from beingpermeated into the organic light emitting diode.

The encapsulation film includes at least one inorganic film and at leastone organic film to prevent oxygen or water from being permeated into anorganic light emitting layer and an electrode. At this time, at leastone organic film generally includes a polymer, and is formed by ahardening process after being doped on a substrate in a liquid type.Since such an organic film has flexibility until the hardening processis performed, a problem may occur in that the organic film may overflowoutside an area where the encapsulation film is to be formed. Forexample, the organic film may overflow toward a pad area where aplurality of pads is provided. To solve this problem, a dam for blockinga flow of the organic film is formed along the outside of the organiclight emitting diode.

Also, to protect the organic light emitting diode from oxygen or water,at least one inorganic film is entirely formed on the organic lightemitting diode except for a pad area where a pad electrode is arranged.In the manufacturing method of the related art, to expose the padelectrode, a mask for covering the pad electrode is arranged on the padelectrode, and then the inorganic film is formed. The mask is arrangedto be close to the pad electrode such that the inorganic film is notformed in the pad area. At this time, arcing may occur between aboundary surface of the mask for covering the pad area and the padelectrode. If arcing occurs between the mask and the pad electrode, ahigh current entering the pad electrode from the mask may flow into thedisplay device along the pad electrode, whereby a defect may occur.

SUMMARY

The present disclosure has been made in view of the above problems, andthe present disclosure is to provide a display device and a method ofmanufacturing the same.

In addition, the present disclosure is to provide a display device and amethod of manufacturing the same in which arcing may be prevented fromoccurring.

In accordance with an aspect of the present disclosure, the above andother objects can be accomplished by the provision of a display deviceand a method of manufacturing the same, the display device comprising afirst substrate including a display area on which pixels are arranged,and a non-display area surrounding the display area; a dam surroundingthe display area, arranged on the non-display area; a pad electrodearranged outside the dam; and an encapsulation film covering the displayarea and including a first inorganic film and a second inorganic filmarranged on the first inorganic film, wherein the second inorganic filmis overlapped with the pad electrode.

BRIEF DESCRIPTION OF THE DRAWINGS

The above features and other advantages of the present disclosure willbe more clearly understood from the following detailed description takenin conjunction with the accompanying drawings, in which:

FIG. 1 is a perspective view illustrating a display device according toone embodiment of the present disclosure;

FIG. 2 is a block view illustrating a display device according to oneembodiment of the present disclosure;

FIG. 3 is a cross-sectional view briefly illustrating one side of adisplay panel in FIG. 1;

FIG. 4 is a plane view briefly illustrating a first substrate accordingto one embodiment of the present disclosure;

FIG. 5 is a plane view illustrating a touch sensing layer arranged onthe first substrate;

FIG. 6 is a cross-sectional view illustrating an example taken alongline I-I′ of FIG. 5;

FIG. 7 is a flow chart illustrating a method of manufacturing a displaydevice according to one embodiment of the present disclosure;

FIGS. 8A to 8F are cross-sectional views illustrating a method ofmanufacturing a display device according to one embodiment of thepresent disclosure; and

FIGS. 9A to 9D are cross-sectional views illustrating a method ofmanufacturing a display device according to another embodiment of thepresent disclosure.

DETAILED DESCRIPTION

Terms disclosed in this specification should be understood as follows.

The term of a singular expression should be understood to include amultiple expression as well as the singular expression if there is nospecific definition in the context. The terms such as “the first” and“the second” are used only to differentiate one element from otherelements. Thus, a scope of claims is not limited by these terms. Also,it should be understood that the term such as “include” or “have” doesnot preclude existence or possibility of one or more features, numbers,steps, operations, elements, parts or their combinations. It should beunderstood that the term “at least one” includes all combinationsrelated with any one item. For example, “at least one among a firstelement, a second element and a third element” may include allcombinations of two or more elements selected from the first, second andthird elements as well as each element of the first, second and thirdelements. Also, if it is mentioned that a first element is positioned“on or above” a second element, it should be understood that the firstand second elements may be brought into contact with each other, or athird element may be interposed between the first and second elements.

Hereinafter, a display device and a method of manufacturing the sameaccording to the preferred embodiment of the present disclosure will bedescribed with reference to the accompanying drawings. Whereverpossible, the same reference numbers will be used throughout thedrawings to refer to the same or like parts. Also, in the followingdescription of the present disclosure, if detailed description ofelements or functions known in respect of the present disclosure isdetermined to make the subject matter of the present disclosureunnecessarily obscure, the detailed description will be omitted.

Hereinafter, the preferred embodiment of the present disclosure will bedescribed with reference to the accompanying drawings.

FIG. 1 is a perspective view illustrating a display device according toone embodiment of the present disclosure. FIG. 2 is a block viewillustrating a display device according to one embodiment of the presentdisclosure.

Referring to FIGS. 1 and 2, the display device according to theembodiment of the present disclosure includes a display panel 110, ascan driver 120, a data driver 130, a timing controller 160, a hostsystem 170, a touch driver 180, and a touch coordinate calculator 190.

The display device with a built-in touch screen according to theembodiment of the present disclosure may be realized as a flat paneldisplay device such as a Liquid Crystal Display (LCD), Field EmissionDisplay (FED), Plasma Display Panel (PDP), Organic Light EmittingDisplay (OLED), and Electrophoresis display (EPD). Hereinafter, thedisplay device with a built-in touch screen according to the embodimentof the present disclosure is realized as, but not limited to, an organiclight emitting display device.

The display panel 110 includes a display area on which pixels P arearranged to display an image. On the display area 110, data lines D1 toDm (m is a positive integer of 2 or more) and scan lines S1 to Sn (n isa positive integer of 2 or more) are provided. The data lines D1 to Dmmay be formed to cross the scan lines Si to Sn. The pixels P may beformed on the area defined by a crossed structure of the gate lines anddata lines.

Each of the pixels P of the display panel 110 may be connected to anyone of the data lines D1 to Dm and any one of the scan lines S1 to Sn.Each of the pixels P of the display panel 110 may include a drivingtransistor for controlling a drain-source current in accordance with adata voltage applied to a gate electrode, a scan transistor turned on bya scan signal of the scan line, supplying a data voltage of the dataline to the gate electrode of the driving transistor, an organic lightemitting diode for emitting light in accordance with the drain-sourcecurrent of the driving transistor, and a capacitor for storing a voltageof the gate electrode of the driving transistor. Therefore, each of thepixels P may emit light in accordance with the current supplied to theorganic light emitting diode.

The scan driver 120 receives a scan control signal GCS from the timingcontroller 160. The scan driver 120 supplies scan signals to the scanlines Si—Sn in accordance with the scan control signal GCS.

The scan driver 120 may be formed in a non-display area outside one sideor both sides of a display area of the display panel 110 in a GIP (gatedriver in panel) mode. Alternatively, the scan driver 120 is fabricatedof a driving chip, packaged in a flexible film, and may be attached tothe non-display area outside one side or both sides of the display areaof the display panel 110 in a TAB (tape automated bonding) mode.

The data driver 130 receives digital video data DATA and a data controlsignal DCS from the timing controller 160. The data driver 130 convertsthe digital video data DATA into an analogue positive polarity/negativepolarity data voltage in accordance with the data control signal DCS andsupplies them to the data lines. That is, pixels to which the datavoltages will be supplied are selected by the scan signals of the scandriver 120, and the data voltages are supplied to the selected pixels.

The data driver 130 may include a plurality of source drive ICs. Each ofthe plurality of source drive ICs may be packaged into the flexible film140 in a COF (chip on film) or COP (chip on plastic) mode. The flexiblefilm 140 is attached onto pads provided on the non-display area of thedisplay panel 110 using an anisotropic conducting film, whereby thesource drive ICs may be connected to the pads.

The circuit board 150 may be attached to the flexible films 140. Aplurality of circuits realized as driving chips may be packaged onto thecircuit board 150. For example, the timing controller 160 may bepackaged onto the circuit board 150. The circuit board 150 may be aprinted circuit board or flexible printed circuit board.

The timing controller 160 receives digital video data DATA and timingsignals from the host system 170. The timing signals may include avertical synchronization signal, a horizontal synchronization signal, adata enable signal, and a dot clock. The vertical synchronization signalis a signal defining one frame period. The horizontal synchronizationsignal is a signal defining one horizontal period needed to supply thedata voltages to pixels of one horizontal line of the display panel DIS.The data enable signal is a signal for defining a period of inputtingavailable data. The dot clock is a signal repeated with a predeterminedshort period.

In order to control operation timings of the scan driver 120 and thedata driver 130, the timing controller 160 generates a data controlsignal DCS to control operation timing of the data driver 130 and a scancontrol signal GCS for controlling operation timing of the data driver130 based on the timing signals. The timing controller 160 outputs thescan control signal GCS to the scan driver 120 and outputs the digitalvideo data DATA and the data control signal DCS to the data driver 130.

The host system 170 may be realized as a navigation system, a set-topbox, a DVD player, a blue-ray player, a personal computer (PC), a hometheater system, a broadcasting receiver, and a phone system. The hostsystem 170 includes SOC (i.e., system on chip) equipped with a scalerand converts the digital video data DATA of an input image to a formatsuitable to display the display panel 110. The host system 170 transmitsthe digital video data DATA and the timing signals to the timingcontroller 160.

On the display panel 110, not only the data lines D1 to Dm and the scanlines Si to Sn but also first and the second touch electrodes may beformed. The first touch electrodes may be formed to cross the secondtouch electrodes. The first touch electrodes may be connected to a firsttouch driver 181 through first touch lines T1 to Tj, where j is aninteger equal to or greater than 2. The second touch electrodes may beconnected to a second touch driver 182 through second touch lines R1 toRi, where i is an integer equal to or greater than 2. On each of theintersections between the first touch electrodes and the second touchelectrodes, a touch sensor may be formed. The touch sensor according tothe embodiment of the present disclosure is realized as, but not limitedto, a mutual capacitance. The first and the second touch electrodes willbe described later in more detail with reference to FIG. 4.

The touch driver 180 supplies a driving pulse to the first touchelectrodes through the first touch lines T1 to Tj and senses the amountof charge changes in each of the touch sensors through the second touchlines R1 to Ri. That is, in FIG. 2, description will be given based onthat the first touch lines T1 to Tj are Tx lines for supplying a drivingpulse and the second touch lines R1 to Ri are Rx lines for sensing theamount of charge changes in in each of the touch sensors.

The touch driver 180 includes the first touch driver 181, the secondtouch driver 182, and the touch controller 183. The first touch driver181, the second touch driver 182, and the touch controller 183 may beintegrated into one ROIC (i.e., read-out IC).

The first touch driver 181 selects the first touch line to output adriving pulse under the control of the touch controller 183 and suppliesthe driving pulse to the selected first touch line. For example, thefirst touch driver 181 may sequentially supply driving pulses to thefirst touch lines T1 to Tj.

The second touch driver 182 selects the second touch lines to receivethe amount of charge changes in the touch sensors under the control ofthe touch controller 183 and receives the amount of charge changes inthe touch sensors through the selected second touch lines. The secondtouch driver 182 converts the amount of charge changes in the touchsensors, which are received through the second touch lines R1 to Ri, totouch raw data TRD corresponding to digital data, by sampling the amountof charge changes in the touch sensors.

The touch controller 183 may generate a Tx setup signal in the firsttouch driver 181 to set up the first touch line to which the drivingpulse is to be output and an Rx setup signal in the second touch line toset up the second touch line in which a touch sensor voltage is to bereceived. Also, the touch controller 183 generates timing controlsignals to control operation timings of the first touch driver 181 andthe second touch driver 182.

The touch coordinate calculator 190 receives touch raw data TRD from thetouch driver 180. The touch coordinate calculator 190 calculates touchcoordinates in accordance with a touch coordinate calculating method andoutputs touch coordinate data HIDxy including information of touchcoordinates to the host system 170.

The touch coordinate calculator 190 may be realized as a MicroController Unit (MCU). The host system 170 analyzes touch coordinatedata HIDxy input from the touch coordinate calculator 190 and executesan application program connected with a coordinate where a touch isgenerated by a user. The host system 170 transmits the digital videodata DATA and the timing signals to the timing controller 160 inaccordance with the executed application program.

The touch driver 180 may be included in the source drive ICs 131 or maybe fabricated of a separate drive chip and packaged onto the circuitboard 150. Also, the touch coordinate calculator 190 may be fabricatedof a driving chip and packaged onto the circuit board 150 FIG. 3 is across-sectional view briefly illustrating one side of a display panel inFIG. 1.

Referring to FIG. 3, the display panel 110 may include a first substrate111, a second substrate 112, a thin film transistor layer 10 arrangedbetween the first and second substrates 111 and 112, an organic lightemitting diode layer 20, an encapsulation layer 30, and a touch sensinglayer 40.

The first substrate 111 may be a plastic film or a glass substrate.

The thin film transistor layer 10 is formed on the first substrate 111.The thin film transistor layer 10 may include scan lines, data lines,and thin film transistors. Each of the thin film transistors includes agate electrode, a semiconductor layer, source and drain electrodes. Inthe case that a scan driver is formed using a GIP (gate driver in panel)method, the scan driver may be formed together with the thin filmtransistor layer 10.

The organic light emitting diode layer 20 is formed on the thin filmtransistor 10. The organic light emitting diode layer 20 includes firstelectrodes, an organic light emitting layer, a second electrode, andbanks. Each of the organic light emitting layers may include a holetransporting layer, an organic light emitting layer, and an electrontransporting layer. In this case, when a voltage is applied to the firstelectrode and the second electrode, holes and electrons are moved to thelight emitting layer through the hole transporting layer and theelectron transporting layer, respectively and are combined in theorganic light emitting layer, thereby emitting light. Since pixels P arearranged on the area where the organic light emitting diode layer 20 isarranged, the area where the organic light emitting diode layer 20 isarranged may be defined as the display area. An area in the periphery ofthe display area may be defined as the non-display area.

The encapsulation layer 30 is formed on the organic light emitting diodelayer 20. The encapsulation layer 30 serves to prevent oxygen and waterfrom being permeated into the organic light emitting diode layer 20. Theencapsulation layer 30 may include at least one inorganic film.

The touch sensing layer 40 is formed on the encapsulation layer 30. Thetouch sensing layer 40 includes first and the second touch electrodesfor sensing a touch of a user, and may include bridge electrodes forelectrically connecting the first touch electrodes or the second touchelectrodes. It may also be said that the touch line of the touch sensinglayer is disposed on a side surface of the encapsulation layer. It mayalso be said that “side surface” refers to an upright or sloping surfaceportion of a layer in a direction substantially perpendicular to, or ata non-zero angle with respect to, the top and bottom surfaces of alayer.

Hereafter, the encapsulation layer 30 and the touch sensing layer 40according to the first embodiment of the present disclosure will bedescribed in more detail with reference to FIGS. 4 to 9.

FIG. 4 is a plane view briefly illustrating a first substrate accordingto one embodiment of the present disclosure, FIG. 5 is a plane viewillustrating a touch sensing layer arranged on the first substrate, FIG.6 is a cross-sectional view illustrating a display device according toone embodiment of the present disclosure, illustrating an example takenalong line I-I′ of FIG. 5.

Referring to FIGS. 4 to 6, the first substrate 111 is categorized into adisplay area DA and a non-display area NDA, wherein pixels P arearranged on the display area DA. The non-display area NDA surrounds thedisplay area DA, and is provided with a dam DAM, and is also providedwith a pad area PA where a bending area BA and pad electrodes PAD areformed outside the dam DAM. It may be said that a DAM is a barrierstructure for preventing a material, such as the organic film layer,from flowing or spreading.

The thin film transistor layer 10 and the organic light emitting diodelayer 20 are formed on the first substrate 111.

The thin film transistor layer 10 includes thin film transistors 210, agate insulating film 220, an inter-layer dielectric film 230, and aplanarization film 241.

A buffer film may be arranged on one surface of the first substrate 111.The buffer film may be formed on one surface of the first substrate 111to protect the thin film transistors 210 and light emitting diodes 260from water permeated through the first substrate 111 which is vulnerableto moisture permeability. One surface of the first substrate 111 may bea surface facing the second substrate 112. The buffer film may be madeof a plurality of inorganic films which are deposited alternately. Forexample, the buffer film may be formed of a multi-layered film of one ormore inorganic films of a silicon oxide film (SiOx), a silicon nitridefilm (SiNx) and SiON, which are deposited alternately. The buffer filmmay be omitted.

The thin film transistor 210 is arranged on the buffer film. The thinfilm transistor 210 includes an active layer 211, a gate electrode 212,a source electrode 213, and a drain electrode 214. Although the thinfilm transistor 210 is formed in a top gate mode in which the gateelectrode 212 is arranged above the active layer 211 as shown in FIG. 6,it is to be understood that the thin film transistor of the presentdisclosure is not limited to the top gate mode. That is, the thin filmtransistor 210 may be formed in a bottom gate mode in which the gateelectrode 212 is arranged below the active layer 211 or a double gatemode in which the gate electrode 212 is arranged above and below theactive layer 211.

The active layer 211 is arranged on the first substrate 111. The activelayer 211 may be formed of a silicon based semiconductor material or anoxide based semiconductor material. A light-shielding layer forshielding external light entering the active layer 211 may be formedbetween the first substrate 111 and the active layer 211.

The gate insulating film 220 may be arranged on the active layer 211.The gate insulating film 220 may be formed of an inorganic film, forexample, a silicon oxide film (SiOx), a silicon nitride film (SiNx) or amulti-layered film of the silicon oxide film and the silicon nitridefilm.

The gate electrode 212 and the first connection line 215 may be arrangedon the gate insulating film 220. The first connection line 215 isarranged to be spaced apart from the gate electrode 212 on thenon-display area NDA. The gate electrode 212 and the first connectionline 215 may be formed of a single layer or multi-layer comprised of anyone of Mo, Al, Cr, Au, Ti, Ni, Nd and Cu or their alloy.

The inter-layer dielectric film 230 may be arranged on the gateelectrode 212 and the first connection line 215. The inter-layerdielectric film 230 may be formed of an inorganic film, for example, asilicon oxide film (SiOx), a silicon nitride film (SiNx), or amulti-layered film of the silicon oxide film and the silicon nitridefilm.

The source electrode 213, the drain electrode 214, a second connectionline 216 and a third connection line 217 may be arranged on theinter-layer dielectric film 230. Each of the source electrode 213 andthe drain electrode 214 may be connected to the active layer 211 througha contact hole that passes through the gate insulating film 220 and theinter-layer dielectric film 230. Also, the second connection line 216and the third connection line 217 are arranged on the non-display areaNDA, and may be connected to the first connection line 215 through acontact hole that passes through the inter-layer dielectric film 230.The source electrode 213, the drain electrode 214, the second connectionline 216 and the third connection line 217 may be formed of a singlelayer or multi-layer comprised of any one of Mo, Al, Cr, Au, Ti, Ni, Ndand Cu or their alloy.

A passivation film may be formed on the source electrode 213 and thedrain electrode 214 to insulate the thin film transistor 210. Thepassivation film may be formed of an inorganic film, for example, asilicon oxide film (SiOx), a silicon nitride film (SiNx), or amulti-layered film of the silicon oxide film and the silicon nitridefilm. This passivation film may be omitted.

The planarization film 241 for planarizing a step difference due to thethin film transistor 210 may be arranged on the source electrode 213 andthe drain electrode 214. Also, an organic pattern 242 and a lineprotective film 243 are arranged on the third connection line 217. Itmay be said that the organic pattern is bendable within the bendingarea. Further, the organic pattern may alternatively be a bending film.

The organic pattern 242 is arranged between the dam DAM and the padelectrode PAD, and may be arranged to partially an upper portion of thethird connection line 217. The organic pattern 242 prevents the thirdconnection line 217 in the bending area BA where the first substrate 111is bent from being externally exposed and serves to protect the thirdconnection line 217. Also, the organic pattern 242 is provided with anopen hole OH of which upper portion is exposed. That is, organic films,which may be arranged on the organic pattern 242, for example, the firstinorganic film 310, the second inorganic film 330 and the insulatingfilm 410 are removed. If the inorganic film is arranged on the organicpattern 242, a crack may be generated in the inorganic film when thebending area BA is bent. Since water may be permeated into the inorganicfilm where a crack is generated, the inorganic films provided on theorganic pattern 242 are removed.

The line protective film 243 is arranged to surround an end of the thirdconnection line 217. The line protective film 243 protects the end ofthe third connection line 217 arranged at an edge of the non-displayarea NDA.

The organic pattern 242 and the line protective film 243 are arranged onthe same layer as the planarization film 241, and may be made of thesame material. The planarization film 241, the organic pattern 242 andthe line protective film 243 may be formed of an organic film such asacrylic resin, epoxy resin, phenolic resin, polyamide resin, andpolyimide resin.

The organic light emitting diode layer 20 is arranged on the thin filmtransistor layer 10. The organic light emitting diode layer 20 includesan organic light emitting diode 250 and a bank 260.

The organic light emitting diode 250 and the bank 260 are arranged onthe planarization film 241. The organic light emitting diode 250includes the first electrode 251, the organic light emitting layer 252,and the second electrode 253. The first electrode 251 may be an anodeelectrode, and the second electrode 253 may be a cathode electrode.

The first electrode 251 may be formed on the planarization film 241. Thefirst electrode 251 may be connected to the source electrode 213 of thethin film transistor 210 through a contact hole that passes through thepassivation film and the planarization film 241. The first electrode 251may be formed of conductive material with high reflexibility such as adeposition structure (Ti/Al/Ti) of Al and Ti, a deposition structure(ITO/Al/ITO) of Al and ITO, an APC alloy, or a deposition structure(ITO/APC/ITO) of APC alloy and ITO. The APC alloy is an alloy of Ag, Pdand Cu.

In order to partition pixels P, the bank 260 may be arranged on theplanarization film 241 to cover an edge of the first electrode 251. Thatis, the bank 260 serves as a pixel defining film for defining pixels P.The bank 260 may be formed of an organic film such as acrylic resin,epoxy resin, phenolic resin, polyamide resin, and polyimide resin.

The organic light emitting layer 252 is arranged on the first electrode251 and the bank 260. The organic light emitting layer 252 may include ahole transporting layer, at least one light emitting layer, and anelectron transporting layer. In this case, when a voltage is applied tothe first electrode 251 and the second electrode 253, holes andelectrons are moved to the light emitting layer through the holetransporting layer and the electron transporting layer, respectively,and are combined in the organic light emitting layer to emit light.

The organic light emitting layer 252 may be formed of a white lightemitting layer for emitting white light. In this case, the organic lightemitting layer 252 may be arranged to cover the first electrode 251 andthe bank 260. In this case, a color filter (not shown) may be formed onthe second substrate 112.

Otherwise, the organic light emitting layer 252 may be formed of a redlight emitting layer for emitting red light, a green light emittinglayer for emitting green light, and a blue light emitting layer foremitting blue light. In this case, the organic light emitting layer 252may be arranged on the area corresponding to the first electrode 251 anda color filter may not be arranged on the second substrate 112.

The second electrode 253 is arranged on the organic light emitting layer252. In the case that the organic light emitting display device isformed in a top emission structure, the second electrode 253 may beformed of a transparent conductive material (TCO) such as ITO and IZO,which may transmit light, or a semi-transmissive conductive materialsuch as Mg, Ag, and alloy of Mg and Ag. A capping layer may be arrangedon the second electrode 253.

On the organic light emitting diode layer 20, the encapsulation layer 30is formed not only on the display area DA but also on the non-displayarea NDA. The encapsulation layer 30 includes a dam DAM and anencapsulation film 300.

The dam DAM is arranged on the non-display area NDA and blocks a flow ofan organic film 320 constituting the encapsulation film 300. In moredetail, the dam DAM is arranged to surround the outside of the displayarea DA and blocks a flow of the organic film 320 constituting theencapsulation film 300. The dam DAM may also be arranged on thenon-display area NDA to block the flow of the organic film 320, therebyallowing the organic film 320 constituting the encapsulation film 300not to be permeated into the pad electrode PAD. Therefore, the dam DAMmay prevent the organic film 320 from being exposed to the outside ofthe display device or from being permeated into the pad electrode PAD.

Such a dam DAM may include a first dam D1 and a second dam D2.

The first dam D1 may be arranged to surround the outside of the displayarea DA to primarily block the flow of the organic film 320 constitutingthe encapsulation film 300. Also, the first dam D1 may be arrangedbetween the display area DA and the pad area PA to primarily block theflow of the organic film 320 by preventing the organic film 320 frombeing permeated into the exposed pad area PA.

The second dam D2 is arranged to surround the outside of the first damD1, and is spaced apart from the first dam D1 and arranged in parallelwith the first dam D1. The second dam D2 may secondarily block the flowof the organic film 320 toward the outside of the first dam D1.Therefore, the first dam D1 and the second dam D2 may more effectivelyprevent the organic film 320 from being exposed to the outside of thedisplay device or from being permeated into the exposed pad area PA. Itmay also be said that the dams are arranged on a routing area, therouting area being between the touch electrodes and the pad and bendingareas of the display.

Such a dam DAM may be formed simultaneously with the planarization film241 or the bank 260 and formed of the same material as that of theplanarization film 241 or the bank 260. In this case, the dam DAM may beformed of an organic film such as acrylic resin, epoxy resin, phenolicresin, polyamide resin, and polyimide resin.

The encapsulation film 300 serves to prevent oxygen or water from beingpermeated into the organic light emitting layer 252 and the secondelectrode 253. To this end, the encapsulation film 300 may include atleast one inorganic film and at least one organic film. For example, theencapsulation film 300 may include a first inorganic film 310, theorganic film 320, and a second inorganic film 330.

The first inorganic film 310 is arranged on the second electrode 253.The first inorganic film 310 is arranged to cover the second electrode253. The first inorganic film 310 according to one embodiment of thepresent disclosure covers the second electrode 253 and is extend to thenon-display area NDA to cover the dam DAM. Also, the first inorganicfilm 310 according to one embodiment of the present disclosure isextended to the pad area PA arranged outside the dam DAM and overlappedwith the pad electrode PAD. It may be said that elements that are“overlapped” refers to any element that extends over another element,but it also may refer generally to an element that is on a differentlayer to another element, and extends above or below said anotherelement. For example, a first film underneath a second film may also beconsidered to overlap the second film.

In the display device 100 according to one embodiment of the presentdisclosure, since the first inorganic film 310 is extended to the padarea PA, it is not required to arrange a mask for covering the pad areaPA so as not to form the first inorganic film 310 on the pad area PA.Therefore, in the display device 100 according to one embodiment of thepresent disclosure, a mask is not arranged on the pad area PA to preventarcing from being generated between a boundary surface of the mask andthe pad electrode PAD arranged on the pad area PA or the metal line suchas the third connection line 217 and prevent a defect from beinggenerated due to a high current from the mask, which flows into thedisplay device along the metal line.

The organic film 320 is arranged on the first inorganic film 310. Theorganic film 320 may be formed with a sufficient thickness to preventparticles from being permeated into the organic light emitting layer 252and the second electrode 253 by passing through the first inorganic film310. The organic film 320 may be formed by a hardening process afterbeing deposited in a liquid type through an inkjet process.

The second inorganic film 330 is arranged on the organic film 320. Thesecond inorganic film 330 is arranged to cover the organic film 320. Thesecond inorganic film 330 according to one embodiment of the presentdisclosure covers the organic film 320 and may be extended to thenon-display area NDA to cover the dam DAM. Also, the first inorganicfilm 310 according to one embodiment of the present disclosure isextended to the pad area PA arranged outside the dam DAM and overlappedwith the pad electrode PAD. At this time, the first inorganic film 310and the second inorganic film 330 according to one embodiment of thepresent disclosure may be formed to have their ends of the sameposition. It may also be said that an end of the first inorganic filmand an end of the second inorganic film are in line with each other. Itmay also be said that film ends “in line with each other” refer to filmends that extend above or below each other and terminate at a similarpoint, one end not extending beyond the other.

In the display device 100 according to one embodiment of the presentdisclosure, since the second inorganic film 330 is extended to the padarea PA, it is not required to arrange a mask for covering the pad areaPA so as not to form the second inorganic film 330 on the pad area PA.Therefore, in the display device 100 according to one embodiment of thepresent disclosure, a mask is not arranged on the pad area PA to preventarcing from being generated between a boundary surface of the mask andthe pad electrode PAD arranged on the pad area PA or the metal line suchas the third connection line 217 and prevent a defect from beinggenerated due to a high current from the mask, which flows into thedisplay device along the metal line.

Also, in the display device 100 according to one embodiment of thepresent disclosure, since the first inorganic film 310 is formed on thepad area PA, arcing is not generated between the boundary surface of themask and the pad electrode PAD arranged on the pad area PA or the metalline such as the third connection line 217 even though the mask isarranged on the pad area PA. That is, the first inorganic film 310 mayserve as an insulating film. In this way, in the display device 100according to one embodiment of the present disclosure, since the firstinorganic film 310 formed to reach the pad area PA serves as aninsulating film, arcing is not generated even though the mask isarranged on the pad area PA during a manufacturing process of the secondinorganic film 330.

Each of the first and second inorganic films 310 and 330 may be formedof a silicon nitride, an aluminum nitride, a zirconium nitride, atitanium nitride, a hafnium nitride, a tantalum nitride, a siliconoxide, an aluminum oxide, or a titanium oxide. The organic film 320 maybe formed of acrylic resin, epoxy resin, phenolic resin, polyamideresin, or polyimide resin.

The touch sensing layer 40 is formed on the encapsulation layer 30. Thetouch sensing layer 40 includes bridge electrodes BE, an insulating film410, first touch electrodes TE1, second touch electrodes TE2, a padelectrode PAD, and a passivation film 420.

In the display device 100 according to one embodiment of the presentdisclosure, the bridge electrode BE is formed on the encapsulation film300, and no inorganic film is formed between the encapsulation film 300and the bridge electrode BE. In the related art, a buffer layer isformed on the encapsulation film 300 to protect the pad electrode PAD orthe metal line exposed when the bridge electrode BE is formed. However,in the display device 100 according to one embodiment of the presentdisclosure, since the metal line such as the third connection line 217is not exposed by the first inorganic film 310 and the second inorganicfilm 330 when the bridge electrode BE is formed, it is not required toform the buffer layer. Therefore, in the display device 100 according toone embodiment of the present disclosure, the buffer layer is omitted,whereby the manufacturing cost may be reduced and the process may bereduced.

The bridge electrode BE is formed on the second inorganic film 330. Inorder to prevent the first touch electrodes TE1 and the second touchelectrodes TE2 from short-circuiting at their crossing areas, the bridgeelectrode BE electrically connects the first touch electrodes TE1adjacent to each other in a first direction. The bridge electrode BE isformed on a different layer from the first and second touch electrodesTE1 and TE2, and may be connected to the first touch electrodes TE1adjacent to each other through bridge contact holes BCT. The bridgeelectrode BE may cross the second touch electrode TE2.

The insulating film 410 is arranged on the bridge electrode BE. Theinsulating film 410 is arranged to cover the bridge electrode BE,thereby insulating the bridge electrode BE from the first and secondtouch electrodes TE1 and TE2. The insulating film 410 according to oneembodiment of the present disclosure covers the bridge electrode BE, andis extended to the non-display area NDA, whereby the insulating film maybe formed to reach the pad area PA. Also, the insulating film 410according to one embodiment of the present disclosure may be extended tothe pad area PA arranged outside the dam DAM.

In the display device 100 according to one embodiment of the presentdisclosure, since the insulating film 410 is extended to the pad areaPA, it is not required to arrange a mask for covering the pad electrodePAD on the pad electrode PAD so as not to form the insulating film 410on the pad area PA.

The first inorganic film 310, the second inorganic film 330 and theinsulating film 410 formed on the third connection line 217 may beremoved simultaneously during the process of forming the bridge contacthole BCT. That is, the bridge contact hole BCT and the pad contact holePCT may be formed at the same time.

The first touch electrodes TE1 and the second touch electrodes TE2 arearranged on the insulating film 410. The first touch electrodes TE1, thesecond touch electrodes TE2, the first touch lines TL1 and the secondtouch lines TL may be arranged on the same layer. The first touchelectrodes TE1 are arranged in a first direction (y-axis direction) andconnected to each other, and the second touch electrodes TE2 arearranged in a second direction (x-axis direction) and connected to eachother. The first direction (y-axis direction) may be parallel with thescan lines S1 to Sn, and the second direction (x-axis direction) may beparallel with the data lines D1 to Dm. Alternatively, the firstdirection (y-axis direction) may be parallel with the data lines D1 toDm, and the second direction (x-axis direction) may be parallel with thescan lines 51 to Sn.

Each of the first touch electrodes TE1 connected in the first direction(y-axis direction) is electrically insulated from the first touchelectrodes TE1 adjacent thereto in the second direction (x-axisdirection). Each of the second touch electrodes TE2 connected in thesecond direction (x-axis direction) is electrically insulated from thesecond touch electrodes TE2 adjacent thereto in the first direction(y-axis direction).

For this reason, mutual capacitance corresponding to the touch sensormay be formed on the crossed area of the first touch electrode TE1 andthe second touch electrode TE2.

Among the first touch electrodes TE1 connected with each other in thefirst direction (y-axis direction), the first touch electrode TEarranged at one end may be connected to the first touch line TL1 on thenon-display area NDA. The first touch line TL1 may be extended from thefirst touch electrode TE1 and then patterned to reach the non-displayarea NDA. In more detail, the first touch line TL1 according to oneembodiment of the present disclosure is formed on the encapsulation film300, extended to the upper portion of the dam DAM, and electricallyconnected with the second connection line 216 arranged at a lowerportion, by a touch contact hole TCT. That is, the first touch line TL1according to one embodiment of the present disclosure is not formed onthe bending area BA. The first touch line TL1 may electrically beconnected from the first source-drain line 216, the first connectionline 215 and the third connection line 217 to the pad electrode PAD andthen connected to the first touch driver 181 through the pad electrodePAD. Therefore, the first touch electrodes TE1 connected with each otherin the first direction (y-axis direction) may receive a driving pulsefrom the first touch driver 181 through the first touch line TL1.

Among the second touch electrodes TE2 connected with each other in thesecond direction (x-axis direction), the second touch electrode TE2arranged at one end may be connected to the second touch line TL2 on thenon-display area NDA. The second touch line TL2 may be extended from thesecond touch electrode TE2 and then patterned to reach the non-displayarea NDA. In more detail, the second touch line TL2 according to oneembodiment of the present disclosure is formed on the encapsulation film300, extended to the upper portion of the dam DAM, and electricallyconnected with the second connection line 216 arranged at a lowerportion, by a touch contact hole TCT. That is, the second touch line TL2according to one embodiment of the present disclosure is not formed onthe bending area BA. The second touch line TL2 may electrically beconnected from the second connection line 216, the first connection line215 and the third connection line 217 to the pad electrode PAD and thenconnected to the second touch driver 182 through the pad electrode PAD.Therefore, the second touch driver 182 may receive the amount of chargechanges in the touch sensors of the second touch electrodes TE2connected with each other in the second direction (x-axis direction).

The pad electrode PAD is arranged on the pad area PA arranged outsidethe dam DAM and the bending area BA. In more detail, the pad electrodePAD according to one embodiment of the present disclosure may bearranged on the second-source drain line 217, the line protective film243, the first inorganic film 310, the second inorganic film 330 and theinsulating film 410 and overlapped with the first inorganic film 310 andthe second inorganic film 330. In the display device 100 according toone embodiment of the present disclosure, in order to prevent the metalline on the bending area BA from being externally exposed, the padelectrode PAD is electrically connected with the third connection line217 through a pad contact hole that passes through the first inorganicfilm 310, the second inorganic film 330 and the insulating film 410.

The passivation film 420 is arranged on the first touch electrodes TE1and the second touch electrodes TE2. The passivation film 420 maintainscharacteristic stabilization of the display device by blocking a harmfulenvironment from the outside. Also, the passivation film 420 may beformed not only on the first touch electrodes TE1 and the second touchelectrodes TE2 but also between the first touch electrodes TE1 and thesecond touch electrodes TE2. Each of the first touch electrodes TE1 maybe insulated from each of the second touch electrodes TE2 by thepassivation film 420.

According to the embodiment of the present disclosure, since the touchsensing layer 40 is directly formed on the encapsulation layer 30, it isnot required to align the first substrate 111 and the second substrate112 when the first substrate 111 and the second substrate 112 are bondedto each other.

As described above, in the display device 100 according to oneembodiment of the present disclosure, since the first inorganic film 310is extended to the pad area PA, it is not required to arrange a mask forcovering the pad area PA on the pad area PA so as not to form the firstinorganic film 310 on the pad area PA.

Therefore, in the display device 100 according to one embodiment of thepresent disclosure, a mask is not arranged on the pad area PA to preventarcing from being generated between a boundary surface of the mask andthe pad electrode PAD arranged on the pad area PA or the metal line suchas the third connection line 217 and prevent a defect from beinggenerated due to a high current from the mask, which flows into thedisplay device along the metal line.

Also, in the display device 100 according to one embodiment of thepresent disclosure, since the first inorganic film 310 formed to reachthe pad area PA serves as an insulating film, arcing is not generatedeven though the mask is arranged on the pad area PA during amanufacturing process of the second inorganic film 330.

In the display device 100 according to one embodiment of the presentdisclosure, since the metal line such as the third connection line 217is not exposed by the first inorganic film 310 and the second inorganicfilm 330 when the bridge electrode BE is formed, it is not required toform the buffer layer. Therefore, in the display device 100 according toone embodiment of the present disclosure, the buffer layer is omitted,whereby the manufacturing cost may be reduced and the process may bereduced.

FIG. 7 is a flow chart illustrating a method of manufacturing a displaydevice according to one embodiment of the present disclosure, and FIGS.8A to 8F are cross-sectional views illustrating a method ofmanufacturing a display device according to one embodiment of thepresent disclosure.

FIGS. 8A to 8F relate to a method of manufacturing a display deviceaccording to one embodiment of the present disclosure shown in FIG. 6,and the same reference numerals are given to the same elements as thoseof FIG. 6. Hereinafter, the method of manufacturing a display deviceaccording to one embodiment of the present disclosure will be describedwith reference to FIG. 7 and FIGS. 8A to 8F.

First of all, as shown in FIG. 8A, pixels P are formed on the displayarea DA, and second and third connection 216 and 217, an organic pattern242 and a dam DAM are formed on the non-display area NDA surrounding thedisplay area DA (S701).

In more detail, an active layer 211 of a thin film transistor 210 isformed on a first substrate 111. In more detail, an active metal layeris formed on the entire surface of the first substrate 111 by asputtering method or a MOCVD (Metal Organic Chemical Vapor Deposition)method. Then, the active metal layer is patterned by a mask processusing a photoresist pattern to form the active layer 211. The activelayer 211 may be formed of a silicon based semiconductor material or anoxide based semiconductor material.

Then, a gate insulating film 220 is formed on the active layer 211. Thegate insulating film 220 may be formed of an inorganic film, forexample, a silicon oxide film (SiOx), a silicon nitride film (SiNx) or amulti-layered film of the silicon oxide film and the silicon nitridefilm.

Then, a gate electrode 212 of the thin film transistor 210 and a firstconnection line 215 are formed on the gate insulating film 220.Specifically, a first metal layer is formed on the entire surface of thegate insulating film 220 by a sputtering method or a MOCVD method. Then,the first metal layer is patterned by a mask process using a photoresistpattern to form the gate electrode 212 and the first connection line215. The gate electrode 212 and the first connection line 212 may beformed of a single layer or multi-layer comprised of any one of Mo, Al,Cr, Au, Ti, Ni, Nd and Cu or their alloy.

Then, an inter-layer dielectric film 230 is formed on the gate electrode212. The inter-layer dielectric film 230 may be formed of an inorganicfilm, for example, a silicon oxide film (SiOx), a silicon nitride film(SiNx), or a multi-layered film of the silicon oxide film and thesilicon nitride film.

Then, contact holes for exposing the active layer 211 by passing throughthe gate insulating film 220 and the inter-layer dielectric film 230 andcontact holes for exposing the first connection line 215 by passingthrough the inter-layer dielectric film 230 are formed.

Then, source and drain electrodes 213 and 214 and the second and thirdconnection lines 216 and 217 of the thin film transistor 210 are formedon the inter-layer dielectric film 230. Specifically, a second metallayer is formed on the entire surface of on the inter-layer dielectricfilm 230 by a sputtering method or a MOCVD method. Then, the secondmetal layer is patterned by a mask process using a photoresist patternto form the source and drain electrodes 213 and 214 and the second andthird connection lines 216 and 217. Each of the source and drainelectrodes 213 and 214 may be connected to the active layer 211 throughcontact holes that pass through the gate insulating film 220 and theinter-layer dielectric film 230. Also, the second and third connectionlines 216 and 217 may be connected to the first connection line 215through contact holes that pass through the inter-layer dielectric film230. Each of the source and drain electrodes 213 and 214 and the secondand third connection lines 216 and 217 may be formed of a single layeror multi-layer comprised of any one of Mo, Al, Cr, Au, Ti, Ni, Nd and Cuor their alloy.

Then, a planarization film 241 for planarizing a step difference due tothe thin film transistor 210 is formed on the source and drainelectrodes 213 and 214 of the thin film transistor 210. An organicpattern 242 and a line protective film 243 are arranged on the secondand third connection lines 216 and 217. The planarization film 241, theorganic pattern 242 and the line protective film 243 may be formed atthe same time, and may be formed of an organic film such as acrylicresin, epoxy resin, phenolic resin, polyamide resin, and polyimideresin. Meanwhile, the line protective film 243 may be formed at a heightlower than those of the planarization film 241 and the organic pattern242.

Then, an organic light emitting diode 250 is formed on the planarizationfilm 241. Specifically, a first electrode 251 of the organic lightemitting diode 250 is formed on the planarization film 241. Morespecifically, a third metal layer is formed on the entire surface of theplanarization film 241 using a sputtering method or a MOCVD method.Then, the third metal layer is patterned by a mask process using aphotoresist pattern to form the first electrode 251. The first electrode251 may be connected to the source electrode 213 of the thin filmtransistor 210 through a contact hole that passes through theplanarization film 241. The first electrode 251 may be formed of aconductive material with high reflexibility such as a depositionstructure (Ti/Al/Ti) of Al and Ti, a deposition structure (ITO/Al/ITO)of Al and ITO, an APC alloy, or a deposition structure (ITO/APC/ITO) ofAPC alloy and ITO.

Then, in order to partition the pixels P, a bank 260 is formed on theplanarization film 241 to cover an edge of the first electrode 251, anda dam DAM is also formed together with the bank 260. In this case, thedam DAM is formed on the non-display area NDA. Each of the dam DAM andthe bank 260 may be formed of an organic film such as acrylic resin,epoxy resin, phenolic resin, polyamide resin, and polyimide resin.

Meanwhile, the dam DAM is formed simultaneously with the bank 260 but isnot limited to this example. The dam DAM may be formed simultaneouslywith the planarization film 241.

Then, an organic light emitting layer 252 is formed on the firstelectrode 251 and the bank 260 by a deposition process or a solutionprocess. Then, the second electrode 253 is formed on the organic lightemitting layer 252. The second electrode 253 may be a common layer thatis commonly formed on the pixels P. The second electrode 253 may beformed of a transparent conductive material (TCO) such as ITO and IZO,which may transmit light. The second electrode 253 may be formed byphysics vapor deposition such as a sputtering method. A capping layermay be formed on the second electrode 253.

Secondly, as shown in FIG. 8B, a first inorganic film 310 is entirelyformed on the first substrate 111 (S702).

The first inorganic film 310 according to one embodiment of the presentdisclosure covers the second electrode 253, and is extended to thenon-display area NDA to cover the dam DAM and the third connection line217. In the display device 100 according to one embodiment of thepresent disclosure, since the first inorganic film 310 is extended tothe pad area PA, it is not required to arrange a mask for covering thepad area PA on the pad area PA so as not to form the first inorganicfilm 310 on the pad area PA. Therefore, in the display device 100according to one embodiment of the present disclosure, a mask is notarranged on the pad area PA to prevent arcing from being generatedbetween a boundary surface of the mask and the metal line and prevent adefect from being generated due to a high current from the mask, whichflows into the display device.

Thirdly, as shown in FIG. 8C, an organic film 320 is formed on the firstinorganic film 310, a second inorganic film 330 is entirely formed onthe first substrate 111, and a bridge electrode BE is formed on thesecond inorganic film 330 (S703).

The organic film 320 is formed to cover the first inorganic film 310.The organic film 320 is preferably formed with a sufficient thickness toprevent particles from being permeated into the organic light emittinglayer 252 and the second electrode 253 by passing through the firstinorganic film 310. The second inorganic film 330 is entirely formed onthe first substrate 111 to cover the organic film 320.

Each of the first and second inorganic films 310 and 330 may be formedof a silicon oxide, a silicon nitride, a silicon oxynitride, an aluminumoxide, an aluminum nitride, a zirconium nitride, a titanium nitride, ahafnium nitride, a tantalum nitride, or a titanium oxide. The organicfilm 320 may be formed of acrylic resin, epoxy resin, phenolic resin,polyamide resin, or polyimide resin. Then, the bridge electrode BE isformed on the display area DA of the second inorganic film 330. At thistime, the bridge electrode BE may be formed to, but not limited to,overlap the bank 260.

In the display device 100 according to one embodiment of the presentdisclosure, the buffer layer is not formed on the encapsulation film300, and the bridge electrode BE is formed on the encapsulation film300. In the related art, the buffer layer is formed on the encapsulationfilm 300 to protect the metal line exposed when the bridge electrode BEis formed. However, in the display device 100 according to oneembodiment of the present disclosure, since the metal lines are notexposed by the first inorganic film 310 when the bridge electrode BE isformed, it is not required to form the buffer layer. Therefore, in thedisplay device 100 according to one embodiment of the presentdisclosure, the buffer layer is omitted, whereby the manufacturing costmay be reduced and the process may be reduced.

According to the process of forming the bridge electrode BE, a fourthmetal layer is formed on the entire surface of the second inorganic film330 by a sputtering method or a MOCVD method. Then, the fourth metallayer is patterned by a mask process using a photoresist pattern to formthe bridge electrode BE.

Fourthly, as shown in FIG. 8D, an insulating film 410 is entirely formedon the first substrate 111 (S704).

The insulating film 410 according to one embodiment of the presentdisclosure covers the bridge electrode BE, and is extended to thenon-display area NDA to cover the dam DAM and the third connection line217. In the display device 100 according to one embodiment of thepresent disclosure, since the insulating film 410 is extended to the padarea PA, it is not required to arrange a mask for covering the pad areaPA on the pad area PA so as not to form the insulating film 410 on thepad area PA.

Fifthly, as shown in FIG. 8E, a bridge contact hole BCT, a touch contacthole TCT, an open hole OH, and a pad contact hole PCT are formed (S705).

The bridge contact hole BCT exposes the bridge electrode BE by passingthrough the insulating film 410. The touch contact hole TCT exposes thesecond connection line 216 by passing through the first and secondinorganic films 310 and 330 and the insulating film 410. The open holeOH exposes the organic pattern 242 by passing through the first andsecond inorganic films 310 and 330 and the insulating film 410. The padcontact hole PCT exposes third connection line 217 by passing throughthe first and second inorganic films 310 and 330 and the insulating film410. The bridge contact hole BCT, the touch contact hole TCT, the openhole OH, and the pad contact hole PCT may simultaneously be formed by anetching process.

The bridge electrode BE may be connected to first touch electrodes TE1through the bridge contact hole BCT, which passes through the insulatingfilm 410, to electrically connect the first touch electrodes TE1.

The first and second touch lines TL1 and TL2 may electrically beconnected to the second connection line 216 through the touch contacthole TCT that passes through the first and second inorganic films 310and 330 and the insulating film 410.

The pad electrode PAD may electrically be connected to the thirdconnection line 217 through the pad contact hole PCT that passes throughthe first and second inorganic films 310 and 330 and the insulating film410.

Sixthly, as shown in FIG. 8F, the first and second touch electrodes TE1and TE2, the first and second touch lines TL1 and TL2 and the padelectrode PAD are formed, and the passivation film 420 is formed (S706).

In detail, the first touch electrodes TE1, the second touch electrodesTE2, the first and second touch lines TL1 and TL2 and the pad electrodePAD are formed on the insulating film 410. The first touch electrodesTE1 are arranged in a first direction to be spaced apart from each otherat a constant space, and the second touch electrodes TE2 are arranged ina second direction to be connected to each other. In this case, each ofthe first touch electrodes TE1 and the second touch electrodes TE2 mayhave shapes of a rectangle, an octagon, a circle, or a rhombus.

Among the first touch electrodes TE1 connected with each other in thefirst direction, the first touch electrode TE1 arranged at one end maybe connected to the first touch line TL1 on the non-display area NDA.The first touch line TL1 may be extended from the first touch electrodeTE1 and then patterned to reach the upper portion of the dam DAM. Thefirst touch electrode TE1, the first touch line TL1 and the padelectrode PAD may be formed on the same layer, and may be formed of thesame material.

Among the second touch electrodes TE2 connected with each other in thesecond direction, the second touch electrode TE2 arranged at one end maybe connected to the second touch line TL2 on the non-display area NDA.The second touch line TL2 may be extended from the second touchelectrode TE2 and then patterned to reach the upper portion of the damDAM. The second touch electrode TE2, the second touch line TL2 and thepad electrode PAD may be formed on the same layer, and may be formed ofthe same material.

The first touch electrodes TE1, the second touch electrodes TE2, thefirst touch lines TL1, and the second touch lines TL2 may be formed of atransparent conductive material (TCO) such as ITO and IZO, which maytransmit light.

A fifth metal layer is formed on the entire surface of the insulatingfilm 410 by a sputtering method or a MOCVD method. Then, the fifth metallayer is patterned by a mask process using a photoresist pattern to formthe first touch electrodes TE1, the second touch electrodes TE2, thefirst touch lines TL1, the second touch lines TL2 and the pad electrodePAD.

Then, a passivation film 420 is formed on the first touch electrode TE1and the second touch electrode TE2.

Although not shown in detail, the first substrate 111 where thepassivation film 420 is formed is bonded to the second substrate 112.The first substrate 111 and the second substrate 112 may be bonded toeach other in such a manner that the passivation film 420 of the firstsubstrate 111 and the second substrate 112 are adhered to each otherusing an adhesive layer (not shown). The adhesive layer (not shown) maybe an optically clear resin (OCR) or an optically clear adhesive film(OCA).

In the display device 100 according to one embodiment of the presentdisclosure, since the first inorganic film 310 is extended to the padarea PA, it is not required to arrange a mask for covering the pad areaPA so as not to form the first inorganic film 310 on the pad area PA.Therefore, in the display device 100 according to one embodiment of thepresent disclosure, a mask is not arranged on the pad area PA to preventarcing from being generated between a boundary surface of the mask andthe pad electrode and prevent a defect from being generated due to ahigh current from the mask, which flows into the display device.

FIGS. 9A to 9D are cross-sectional views illustrating a method ofmanufacturing a display device according to another embodiment of thepresent disclosure.

Plane views shown in FIGS. 9A to 9D relate to a method of manufacturinga display device according to one embodiment of the present disclosureshown in FIG. 6, and the same reference numerals are given to the sameelements as those of FIG. 6. Also, the method of manufacturing a displaydevice according to another embodiment of the present disclosure relatesto a method of forming a bridge contact hole BCT, a touch contact holeTCT, an open hole OH, and a pad contact hole PCT. Therefore, thefollowing description will be given based on a method of manufacturing abridge contact hole BCT, a touch contact hole TCT, an open hole OH, anda pad contact hole PCT, and repeated description of the same elementswill be omitted.

First of all, as shown in FIG. 9A, an insulating film 410 is entirelyformed on a first substrate 111.

Secondly, as shown in FIG. 9B, after a first inorganic film 310 providedon the second and third connection lines 216 and 217 and an organicpattern 242 partially remains, a second inorganic film 330 on a touchcontact hole TCT1, an open hole OH1 and a pad contact hole PCT1, and theinsulating film 410 are removed. At this time, a bridge contact hole BCTis not formed. If the bridge contact hole BCT, the touch contact holeTCT, the open hole OH and the pad contact hole PCT are simultaneouslyformed through an etching process like one embodiment, the bridgeelectrode BE and the second and third connection lines 216 and 217 maybe damaged. Therefore, in the method of manufacturing a display deviceaccording to another embodiment of the present disclosure, the touchcontact hole TCT1, the open hole OH1 and the pad contact hole PCT1,which should pass through a relatively thick layer, are first formedsuch that the first inorganic film 310 may partially remain, and thebridge contact hole BCT is not formed.

Thirdly, as shown in FIG. 9C, the bridge contact hole BCT, the touchcontact hole TCT, the open hole OH and the pad contact hole PCT areformed.

The first inorganic film 310, which partially remains in the touchcontact hole TCT, the open hole OH and the pad contact hole PCT1, andthe insulating film 410 on the bridge electrode BE are simultaneouslyremoved through an etching process. The first inorganic film 310 whichremains at a relatively thin thickness and the insulating film 410 onthe bridge electrode BE are removed through an weak etching process suchthat the second and third connection lines 216 and 217 and the bridgeelectrode BE may not be damaged. Therefore, in the method ofmanufacturing a display device according to another embodiment of thepresent disclosure, the second and third connection lines 216 and 217and the bridge electrode BE may be prevented from being damaged when thebridge contact hole BCT, the touch contact hole TCT, the open hole OHand the pad contact hole PCT are formed.

Fourthly, as shown in FIG. 9D, first and second touch electrodes TE1 andTE2, first and second touch lines TL1 and TL2, and a pad electrode PADare formed, and a passivation film 420 is formed.

The display device 100, which is shown in FIGS. 9A and 9D, is the sameas the display device 100 according to one embodiment described withreference to FIGS. 8A to 8F. Therefore, repeated description of the sameelements will be omitted.

As described above, in the display device 100 according to oneembodiment of the present disclosure, a mask is not arranged on the padarea PA to prevent arcing from being generated between a boundarysurface of the mask and the pad electrode PAD arranged on the pad areaPA or the metal line such as the third connection line 217 and prevent adefect from being generated due to a high current from the mask, whichflows into the display device along the metal line.

Also, in the display device 100 according to one embodiment of thepresent disclosure, since the first inorganic film 310 formed to reachthe pad area PA serves as an insulating film, arcing is not generatedeven though the mask is arranged on the pad area PA during themanufacturing process of the second inorganic film 330.

In the display device 100 according to one embodiment of the presentdisclosure, since the metal line such as the third connection line 217is not exposed by the first inorganic film 310 and the second inorganicfilm 330 when the bridge electrode BE is formed, it is not required toform the buffer layer. Therefore, in the display device 100 according toone embodiment of the present disclosure, the buffer layer is omitted,whereby the manufacturing cost may be reduced and the process may bereduced.

As described above, according to the present disclosure, the followingadvantages may be obtained.

In the display device according to one embodiment of the presentdisclosure, since the first inorganic film is formed to be extended tothe pad area, it is not required to arrange the mask for covering thepad area so as not to form the first inorganic film on the pad area.

Therefore, in the display device according to one embodiment of thepresent disclosure, the mask is not arranged on the pad area to preventarcing from being generated between the boundary surface of the mask andthe pad electrode arranged on the pad area or the metal line and preventa defect from being generated due to a high current from the mask, whichflows into the display device along the metal line.

Also, in the display device according to one embodiment of the presentdisclosure, since the metal line is not exposed by the first inorganicfilm when the bridge electrode is formed, the buffer layer is omitted,whereby the manufacturing cost may be reduced and the process may bereduced.

In addition to the effects of the present disclosure as mentioned above,additional advantages and features of the present disclosure will beclearly understood by those skilled in the art from the abovedescription of the present disclosure.

It will be apparent to those skilled in the art that the presentdisclosure described above is not limited by the above-describedembodiments and the accompanying drawings and that varioussubstitutions, modifications, and variations can be made in the presentdisclosure without departing from the spirit or scope of thedisclosures. Consequently, the scope of the present disclosure isdefined by the accompanying claims, and it is intended that allvariations or modifications derived from the meaning, scope, andequivalent concept of the claims fall within the scope of the presentdisclosure.

These and other changes can be made to the embodiments in light of theabove-detailed description. In general, in the following claims, theterms used should not be construed to limit the claims to the specificembodiments disclosed in the specification and the claims, but should beconstrued to include all possible embodiments along with the full scopeof equivalents to which such claims are entitled. Accordingly, theclaims are not limited by the disclosure.

What is claimed is:
 1. A display device comprising: a first substrateincluding a display area on which pixels are arranged and a non-displayarea including a connection line, a pad area, a routing area having arouting line and a bending area disposed between the pad area and therouting area; a dam disposed at the routing area; a pad electrodedisposed at the pad area; and an organic pattern disposed on the bendingarea, wherein the connection line in the non-display area iselectrically connected to the pad electrode and the routing line at therouting area.
 2. The display device of claim 1, further comprising anencapsulation film covering the display area and including at least oneinorganic film and an organic film, wherein the at least one inorganicfilm overlaps the pad electrode.
 3. The display device according toclaim 2, wherein the at least one inorganic film includes first andsecond inorganic films that overlap the pad electrode.
 4. The displaydevice according to claim 1, wherein an end of the first inorganic filmand an end of the second inorganic film are in line with each other. 5.The display device according to claim 1, further comprising: a thin filmtransistor provided at the display area of the first substrate; and aplanarization film arranged on the thin film transistor.
 6. The displaydevice according to claim 5, wherein the organic pattern is disposed inthe same layer as the planarization film.
 7. The display deviceaccording to claim 5, wherein the connection line includes a first andsecond connection lines disposed in different layers.
 8. The displaydevice according to claim 7, wherein the first connection line isdisposed in the same layer as a gate electrode of the thin filmtransistor.
 9. The display device according to claim 7, wherein thesecond connection line is disposed in the same layer as a sourceelectrode and a drain electrode of the thin film transistor.
 10. Thedisplay device according to claim 2, wherein the organic pattern has anupper portion exposed to outside the display device.
 11. The displaydevice according to claim 10, wherein the encapsulation film is notdisposed on at least portion of the upper portion of the organicpattern.
 12. The display device according to claim 2, wherein theconnection line includes first, second and third connection lines,wherein the second connection line is disposed on the first connectionline and electrically connected with one side of the first connectionline through a contact hole, the third connection line is disposed onthe same layer as the second connection line, spaced apart from thesecond connection line and electrically connected with the other side ofthe first connection line, through the contact hole.
 13. The displaydevice according to claim 12, further comprising a first touch linearranged on the encapsulation film and electrically connected with thethird connection line through a touch contact hole, wherein the padelectrode is electrically connected with the second connection linethrough a pad contact hole.
 14. The display device according to claim 7,further comprising a line protective film covering an end of the secondconnection line, wherein the line protective film is arranged on thesame layer as the planarization film.
 15. The display device accordingto claim 2, further comprising a bridge electrode arranged on theencapsulation film, connecting first touch electrodes adjacent to eachother, wherein the bridge electrode crosses second touch electrodesarranged on the same layer as the first touch electrodes and spacedapart from the first touch electrodes, and wherein an inorganic film isnot formed between the encapsulation film and the bridge electrode. 16.The display device of claim 12, wherein the first touch line is formedon a side surface of the encapsulation layer in the routing area.
 17. Amethod of manufacturing a display device, comprising: forming pixels ona display area of a first substrate, and forming a connection line, anorganic pattern and a dam on a non-display area, the connection linecomprising first, second, and third connection lines; forming a firstinorganic film on the first substrate so as to cover the first substrateentirely; forming an organic film on the first inorganic film; forming asecond inorganic film on the first inorganic film so as to cover thefirst inorganic film and the organic film entirely; forming a bridgeelectrode on the second inorganic film; forming an insulating film onthe bridge electrode so as to cover the first substrate entirely;forming a bridge contact hole for exposing the bridge electrode, a touchcontact hole for exposing the third connection line, an open hole forexposing the organic pattern, and a pad contact hole for exposing thesecond connection line; and forming first and second touch electrodesand a first touch line, wherein the first touch electrodes and the firsttouch line are electrically connected with the bridge electrode and thesecond and third connection lines.
 18. The method according to claim 17,wherein the bridge contact hole for exposing the bridge electrode, thetouch contact hole for exposing the third connection line, the open holefor exposing the organic pattern, and the pad contact hole for exposingthe second connection line are simultaneously formed.
 19. The methodaccording to claim 17, wherein the forming the bridge contact hole, thetouch contact hole, the open hole and the pad contact hole includes:removing the second inorganic film and the insulating film on the touchcontact hole, the open hole and the pad contact hole, partially leavingthe first inorganic film provided on the second and third connectionlines and the organic pattern; and simultaneously forming the bridgecontact hole for exposing the bridge electrode, the touch contact holefor exposing the third connection line, the open hole for exposing theorganic pattern, and the pad contact hole for exposing the secondconnection line.